? semiconductor components industries, llc, 2015 january, 2015 ? rev. 7 1 publication order number: MBRP20030CTL/d MBRP20030CTL powertap ii switch-mode power rectifier the switch ? mode power rectifier uses the schottky barrier principle with a platinum barrier metal. this state ? of ? the ? art device has the following features: features ? dual diode construction ? may be paralleled for higher current output ? guardring for stress protection ? low forward voltage drop ? 150 c operating junction temperature ? recyclable epoxy ? guaranteed reverse avalanche energy capability ? improved mechanical ratings ? pb ? free packages are available* mechanical characteristics: ? case: epoxy, molded with metal heatsink base ? weight: 80 grams (approximately) ? finish: all external surfaces corrosion resistant ? top terminal torque: 25 ? 40 lb ? in max ? base plate torques: see procedure given in the package outline section maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current (at rated v r , t c = 125 c) per leg per device i f(av) 100 200 a peak repetitive forward current, (at rated v r , square wave, 20 khz, t c = 100 c) i frm 200 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 1500 a peak repetitive reverse surge current (2.0 s, 1.0 khz) i rrm 2.0 a storage temperature range t stg ? 55 to +150 c operating junction temperature t j ? 55 to +150 c voltage rate of change (rated v r ) dv/dt 10,000 v/ s stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. low v f schottky barrier rectifier 200 amperes, 30 volts device package shipping ordering information MBRP20030CTL powertap ii 25 units/tray 1 2 3 www. onsemi.com MBRP20030CTLg powertap ii (pb ? free) 25 units/tray powertap ii case 357c plastic 1 2 3 marking diagram b20030l b20030l = specific device code mcc = mold compound code a = assembly location yy = year ww = work week g = pb ? free package mcc ayywwg
MBRP20030CTL www. onsemi.com 2 thermal characteristics rating symbol value unit thermal resistance, junction ? to ? case r jc 0.45 c/w electrical characteristics maximum instantaneous forward voltage (note 1) (i f = 200 a, t c = + 125 c) (i f = 200 a, t c = + 25 c) v f 0.52 0.60 v maximum instantaneous reverse current (note 1), (rated dc voltage, t c = + 25 c) i r 5.0 ma product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. pulse test: pulse width = 300 s, duty cycle 2%. maximum mechanical ratings terminal penetration: 0.235 max terminal torque: 25 ? 40 in-lb max mounting torque ? outside holes: 30 ? 40 in-lb max mounting torque ? center hole: 8 ? 10 in-lb max seating plane 1 mil per in. flatness (between mounting holes) powertap mechanical data applies over operating temperature vertical pull 250 lbs. max 2 in. lever pull 50 lbs. max note: while the powertap is capable of sustaining these vertical and levered tensions, the intimate contact note: between powertap and heat sink may be lost. this could lead to thermal runaway. the use of very note: flexible leads is recommended for the anode connections. use of thermal grease is highly recommended. 2
MBRP20030CTL www. onsemi.com 3 mounting procedure the powertap package requires special mounting considerations because of the long longitudinal axis of the copper heatsink. it is important to follow the proper tightening sequence to avoid warping the heatsink, which can reduce thermal contact between the powertap and heat sink. 2 ? 3 turns 2 ? 3 turns 2 ? 3 turns power tap heat sink step 2: finger tighten the center bolt. the bolt may catch on the threads of the heatsink so it is important to make sure the face of the bolt or washer is in contact with the surface of the powertap. 2 ? 3 turns finger-tight 2 ? 3 turns power tap heat sink step 3: tighten each of the end bolts between 5 to 10 in-lb. power tap heat sink 5 ? 10 in-lb finger-tight 5 ? 10 in-lb step 4: tighten the center bolt between 8 to 10 in-lb. 5 ? 10 in-lb 8 ? 10 in-lb 5 ? 10 in-lb power tap heat sink step 5: finally, tighten the end bolts between 30 to 40 in-lb. 30 ? 40 in-lb 8 ? 10 in-lb 30 ? 40 in-lb power tap heat sink step 1: locate the powertap on the heatsink and start mounting bolts into the threads by hand (2 or 3 turns).
MBRP20030CTL www. onsemi.com 4 package dimensions case 357c ? 03 powertap plastic package issue e b 0.25 (0.010) m ta mm dim a min max min max millimeters 3.450 3.635 87.63 92.33 inches b 0.700 0.810 17.78 20.57 c 0.615 0.640 15.63 16.26 e 0.120 0.130 3.05 3.30 f 0.435 0.445 11.05 11.30 g 1.370 1.380 34.80 35.05 h 0.007 0.030 0.18 0.76 n 1/4-20unc-2b 1/4-20unc-2b q 0.270 0.285 6.86 7.23 r 31.50 bsc 80.01 bsc u 0.600 0.630 15.24 16.00 v 0.330 0.375 8.39 9.52 w 0.170 0.190 4.32 4.82 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. terminal penetration: 5.97 (0.235) maximum. r g w n q b 0.25 (0.010) m ta mm 2 pl e seating plane f v u c h ? a ? ? b ? ? t ? on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warrant y, representation or guarantee regarding the suitability of it s products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 MBRP20030CTL/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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